Vacuoles焊洞.
Vacuum Evaporation(or Deposition)真空蒸镀法.
Vacuum Lamination真空压合.
Van Der Waals Force凡得华力.
Vapor Blasting蒸汽喷砂.
Vapor Degreasing蒸汽除油法.
Vapor Phase Soldering气相焊接.
Varnish凡力水,清漆(树脂之液态单体).
V-cutV型切槽.
Very Large-Scale Integration(VLSI)极大绩体电路器.
Via Hole 导通孔.
Vickers Hardness维氏硬度.
Viscosity粘滞度,粘度.
Vision Systems视觉系统.
Visual Examination目视检验.
Void 破洞,空洞.
Volatile Content挥发份含量.
Voltage电压.
Voltage Breakdown崩溃电压.
Voltage Drop 电压降落.
Voltage Efficiency电压效率.
Voltage Plane电压层.
Voltage Plane Clearance电压层的空环.
Volume Resistivity体绩电阻率.
Volume Resistivity体绩电阻率.
Volumetric Analysis容量分析法.
Vulcanization交联,硫化.
                        *****W*****
Wafer晶圆.
Waive暂准过关,暂不检查.
Warp Size 浆经处理.
Warp, Warpage板弯.
Washer垫圈.
Waste Treatment废弃处理.
Water Absorption吸水性.
Water Break水膜破散,水破.
Water Mark水印.
Watt瓦特.
Watts Bath瓦兹镀镍液.
Wave Guide导波管.
Wave Soldering波焊.
Waviness 波纹,波度.
Wear Resistance耐磨性,耐磨度.
Weatherability耐候性.
Weave Eposure织纹显露.
Weave Texture织纹隐现.
Web蹼部.
Wedge Bond 楔形结合点.
Wedge Void楔形缺口(破口).
Weft Yarn纬纱.
Welding熔接.
Wet Blasting湿喷砂.
Wet Lamination湿压膜法.
Wet Process湿式制程.
Wetting Agent润湿剂.
Wetting Balance沾锡天平.
Wetting Balance沾锡,沾湿.
Whirl Brush旋涡式磨刷法.
Whirl Coating旋涡涂布法.
Whisker晶须.
White Residue白色残渣.
White Spot白点.
Wicking灯蕊效应.
Window操作范围,传动齿孔.
Wiping Action 滑动接触(导电).
Wire Bonding打线结合.
Wire Gauge线规.
Wire Lead金属线脚.
Wire Pattern布线图形.
Wire Wrap绕线互连.
Working Master工作母片.
Working Time (Life)堪用时间.
Workmanship 手艺,工艺水平,制作水准.
Woven Cable扁平编线.
Wrinkle皱折, 皱纹.
Wrought Foil锻碾金属箔.
                        *****X*****
X AxisX轴.
X-Ray X光.
X-Ray FluorescenceX萤光.
                        *****Y*****
Yarn纱线.
Y-AxisY轴.
Yield良品率,良率,产率.
Yield Point屈服点.
                         *****Z*****
Z-AxisZ轴.
Zero Centering中心不变(叠合法).
Zig-Zag In-Line Package (ZIP)炼齿状双排脚封装件.

=====================================================
[分享]PCB专业英译术语
一、 综合词汇
1、 印制电路：printed circuit
2、 印制线路：printed wiring
3、 印制板：printed board
4、 印制板电路：printed circuit board (PCB)
5、 印制线路板：printed wiring board(PWB)
6、 印制组件：printed component
7、 印制接点：printed contact
8、 印制板装配：printed board assembly
9、 板：board
10、 单面印制板：single-sided printed board(SSB)
11、 双面印制板：double-sided printed board(DSB)
12、 多层印制板：mulitlayer printed board(MLB)
13、 多层印制电路板：mulitlayer printed circuit board
14、 多层印制线路板：mulitlayer prited wiring board
15、 刚性印制板：rigid printed board
16、 刚性单面印制板：rigid single-sided printed borad
17、 刚性双面印制板：rigid double-sided printed borad
18、 刚性多层印制板：rigid multilayer printed board
19、 挠性多层印制板：flexible multilayer printed board
20、 挠性印制板：flexible printed board
21、 挠性单面印制板：flexible single-sided printed board
22、 挠性双面印制板：flexible double-sided printed board
23、 挠性印制电路：flexible printed circuit (FPC)
24、 挠性印制线路：flexible printed wiring
25、 刚性印制板：flex-rigid printed board, rigid-flex printed board
26、 刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed
27、 刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board
28、 齐平印制板：flush printed board
29、 金属芯印制板：metal core printed board
30、 金属基印制板：metal base printed board
31、 多重布线印制板：mulit-wiring printed board
32、 陶瓷印制板：ceramic substrate printed board
33、 导电胶印制板：electroconductive paste printed board
34、 模塑电路板：molded circuit board
35、 模压印制板：stamped printed wiring board
36、 顺序层压多层印制板：sequentially-laminated mulitlayer
37、 散线印制板：discrete wiring board
38、 微线印制板：micro wire board
39、 积层印制板：buile-up printed board
40、 积层多层印制板：build-up mulitlayer printed board (BUM)
41、 积层挠印制板：build-up flexible printed board
42、 表面层合电路板：surface laminar circuit (SLC)
43、 埋入凸块连印制板：B2it printed board
44、 多层膜基板：multi-layered film substrate(MFS)
45、 层间全内导通多层印制板：ALIVH multilayer printed board
46、 载芯片板：chip on board (COB)
47、 埋电阻板：buried resistance board
48、 母板：mother board
49、 子板：daughter board
50、 背板：backplane
51、 裸板：bare board
52、 键盘板夹心板：copper-invar-copper board
53、 动态挠性板：dynamic flex board
54、 静态挠性板：static flex board
55、 可断拼板：break-away planel