Lay Out布线,布局.
Lay Up 叠合.
Layer to Layer Spacing层间距离
Leaching焊散漂出,熔出.
Lead 引脚.
Lead Frame脚架.
Lead Pitch脚距.
Leakage Current漏电电流.
Legend文字标记.
Leveling整平.
Lifted Land孔环(焊垫)浮起.
Ligand错离子附属体.
Light Emitting Diodes (LED)发光二极管.
Light Integrator光能累积器.
Light Intensity光强度.
Limiting Current Density极限电流密度.
Liquid Crystal Display (LCD)液晶显示器.
Liquid Dielectrics液态介质.
Liquid Photoimagible Solder Mask, (LPSM)液态感光防焊绿漆.
Local Area Network区域性网络.
Logic 逻辑.
Logic Circuit 逻辑电路.
Loss Factor损失因素.
Loss Tangent (TanδDK)损失正切.
Lot Size批量.
Luminance发光强度.
Lyophilic亲水性胶体.
                       *****M*****
Macro-Throwing Power巨观分布力.
Major Defect主要(严重)缺点.
Major Weave Direction主要织向.
Margin刃带(钻头尖部).
Marking标记.
Mask阻剂.
Mass Finishing大量整面(拋光).
Mass Lamination大型压板.
Mass Transport质量输送.
Master Drawing主图.
Mat席(用于CEM-3(Composite Epoxy Material)的
复合材料.)
Matte Side毛面(电镀铜皮(ED Foil)之粗糙面).
Mealing泡点.
Mean Time To Failure (MTTF)故障前可用之平均时数.
Measling白点.
Mechanical Stretcher机械式张网机.
Mechanical Warp机械式缠绕.
Mechanism机理.
Membrane Switch薄膜开关.
Meniscograph Test弧面状沾锡试验.
Meniscus弯月面.
Mercury Vaper Lamp汞气灯.
Mesh Count纲目数.
Metal Halide Lamp 金属卤素灯.
Metallization金属 化.
Metallized Fabric金属化纲布.
Micelle微胞.
Micro Wire Board微封线板.
Micro-electronios微电子.
Microetching微蚀.
Microsectioning微切片法.
Microstrip 微条.
Microstrip Line微条线,微带线.
Microthrowing Power微分布力.
Microwave微波.
Migration迁移.
Migration Rate迁移率.
Mil英丝.
Minimum Annular Ring孔环下限.
Minimum Electrical Spacing电性间距下限.
Minor Weave Direction次要织向.
Misregistration 对不准度.
Mixed Componmt Mounting Technology混合零件之组装技术.
Modem调变及解调器.
Modification修改.
Module模块.
Modulus of Elasticity弹性系数.
Moisture and Insulation Resistance Test湿气与绝缘电阻试验.
Mold Release 脱模剂,离型剂.
Mole摩尔.
Monofilament单丝.
Mother Board主机板,母板.
Moulded Circuit模造立体电路机.
Mounting Hole安装孔.
Mounting Hole组装孔,机装孔.
Mouse Bite鼠齿(蚀刻后线路边缘出现不规则缺口).
Multi-Chip-Module(MCM)多芯片芯片模块.
Multiwiring Board (or Discrete Wiring Board)复线板.
                        *****N*****
N.C.数值控制.
Nail Head钉头.
Near IR近红外线.
Negative负片,钻尖的第一面外缘变窄.
Negative Etch-back反回蚀.
Negative Stencil负性感光膜.
Negative-Acting Resist负性作用之阻剂.
Network纲状元件.
Newton牛顿.
Newton Ring 牛顿环.
Newtonian Liquid牛顿流体.
Nick缺口.
N-Methyl Pyrrolidine (NMP)N-甲基四氢哔咯.
Noble Metal Paste贵金属印膏.
Node节点.
Nodule节瘤.
Nomencleature标示文字符号.
Nominal Cured Thickness标示厚度.
Non-Circular Land非圆形孔环焊垫.
Non-flammable非燃性.
Non-wetting不沾锡.
Normal Concentration  (Strength)标准浓度,当量浓度.
Normal Distribution常态分布.
Novolac酯醛树脂.
Nucleation , Nucleating核化.
Numerical Control数值控制.
Nylon尼龙.
                        *****O*****
Occlusion吸藏.
Off-Contact架空.
Offset第一面大小不均.
OFHC(Oxyen Free High Conductivity)无氧高导电铜.
Ohm欧姆.
Oilcanning盖板弹动.
OLB(Outer Lead Bond)外引脚结合.
Oligomer寡聚物.
Omega Meter离子污染检测仪.
Omega Wave振荡波.
On-Contact Printing密贴式印刷.
Opaquer不透明剂,遮光剂.
Open Circuits断线.
Optical Comparater光学对比器(光学放大器.)
Optical Density光密度.
Optical Inspection光学检验.
Optical Instrument光学仪器.
Organic Solderability Preservatives (OSP)有机保焊剂.
Osmosis渗透.
Outgassing出气,吹气.
Outgrowth悬出,横出,侧出.
Output产出,输出.
Overflow溢流.
Overhang总悬空.
Overlap 钻尖点分离.
Overpotantial(Over voltage)过电位,过电压.
Oxidation氧化.
Oxygen Inhibitor氧化抑制剂.
Ozone Depletion臭氧层耗损.
                         *****P*****
Packaging封装,构装.
Pad焊垫,圆垫.
Pad Master圆垫底片.
Pads Only Board唯垫板.
Palladium钯.
Panel制程板.
Panel Plating全板镀铜.
Panel Process全板电镀法.
Paper Phenolic纸质酚醛树脂(板材).
Parting Agent脱膜剂.
Passivation钝化 ,钝化外理.
Passive Device (Component)被动组件(零件)
Paste膏,糊.
Pattern板面图形.
Pattern Plating线路电镀.
Pattern Process线路电镀法.
Peak Voltage峰值电压.
Peel Strength抗撕强度.
Periodic Reverse (PR) Current周期性反电流.
Peripheral周边附属设备.
Permeability透气性,导磁率.
Permittivity诱电率,透电率.
pH Value酸碱值.
Phase相.
Phase Diagram相图.
Phenolic酚醛树脂.
Photofugitive感光褪色.
Photographic film感光成像之底片.
Photoinitiator感光启始剂.
Photomask光罩.
Photoplotter, Plotter光学绘图机.
Photoresist光阻.
Photoresist Chemical Machinning (Milling)光阻式化学(铣刻)加工.
Phototool底片.
Pick and  Place拾取与放置.
Piezoelectric压电性.
Pin 插脚,插梢,插针.
Pin Grid Array (PGA)矩阵式针脚对装.
Pinhole针孔.
Pink Ring粉红圈.
Pitch跨距,脚距,垫距,线距.
Pits凹点.
Plain Weave平织.
Plasma电浆.
Plasticizers可塑剂,增塑剂.