Fluorescence荧光.
Flurocarbon Resin碳氟树脂.
Flush Conductor嵌入式线路  , 贴平式 导体.
Flush Point闪火点.
Flute退屑槽.
Flux助焊剂.
Foil Burr铜箔毛边.
Foil Lamination铜箔压板法.
Foot残足(干膜残余物).
Foot Print (Land Pattern)脚垫.
Foreign Material 外来物,异物.
Form-to-List布线说明清单.
Four Point Twisting四点扭曲法.
Free Radical自由基.
Freeboard干舷.
Frequency频率.
Frit 玻璃熔料.
Fully-Additive Process全加成法.
Fungus Resistance抗霉性.
Fused Coating熔锡层.
Fusing熔合.
Fusing Fluid助熔液.
                        *****G*****
G-10由连续玻纤所织成的玻纤布与
环氧树脂粘结剂所复合成的材料.
Gage, Gauge量规.
Gallium Arsenide (GaAs)砷化镓.
Galvanic Corrosion贾凡尼式腐蚀(电解式腐蚀).
Galvanic Series贾凡尼次序(电动次序).
Galvanizing镀锌.
GAP第一面分离,长刃断开.
Gate Array闸列,闸极数组.
Gel Time胶化时间.
Gelation Particle胶凝点.
Gerber Data ,Gerber File格博档案(是美商Gerber公司专为PCB面线路
图形与孔位,所发展一系列完整的软件档案).
Ghost Image阴影.
Gilding镀金 (现为:Glod Plating).
Glass Fiber玻纤.
Glass Fiber Protrusion/Gouging, Groove玻纤突出/挖破.
Glass Transition Temperature, Tg玻璃态转化温度.
Glaze釉面,釉料.
Glob Top圆顶封装体.
Glouble Test球状测试法.
Glycol (Ethylene Glycol)乙二醇.
Golden Board测试用标准板.
Grain Size结晶粒度.
Grass Leak 大漏.
Grid标准格.
Ground Plane /Earth Plane接地层.
Ground Plane Clearance接地空环.
Guide Pin导针.
Gull /Wing Lead鸥翼引脚.
                        *****H*****
Halation环晕.
Half Angle半角.
Halide卤化物.
Haloing白圈,白边.
Halon海龙,是CFC"氟碳化物"的一种商品名.
Hard Anodizing硬阳极化.
Hard Chrome Plating镀硬铬.
Hard Soldering硬焊.
Hardener (Curing Agent)硬化剂(或Curing Agent).
Hardness硬度.
Haring-Blum Cell海固槽.
Harness电缆组合.
Hay Wire跳线.
Heat Cleaning烧洁.
Heat Dissipation散热.
Heat Distortion Point (Temp)热变形点(温度).
Heat Sealing热封.
Heat Sink Plane散热层.
Heat Transfer Paste导热膏.
Heatsink Tool散热工具.
Hertz(Hz)赫.
High Efficiency Particulate Air Filter (HEPA)高效空气尘粒过泸机.
Hipot Test 高压电测.
Hi-Rel高度靠度.
Hit 击(钻孔时钻针每一次"刺下"的动作).
Holding Time停置时间.
Hole Breakout孔位破出.
Hole Counter数孔机.
Hole Density孔数密度.
Hole Preparation通孔准备.
Hole Pull Strength孔壁强度.
Hole Void破洞.
Hook 切削刀缘外凸.
Hot Air Levelling喷锡.
Hot Bar Soldering热把焊接.
Hot Gas Soldering热风手焊.
HTE(High Temperature Elongation)高温延伸性.
Hull Cell哈氏槽.
Hybrid Integrated Circuit混成电路.
Hydraulic Bulge Test液压鼓起试验.
Hydrogen Embrittlement氢脆.
Hydrogen Overvoltage氢过(超)电压.
Hydrolysis水解.
Hydrophilic亲水性.
Hygroscopic吸湿性.
Hypersorption超吸咐.
                         *****I*****
I.C. Socket绩体电路器插座.
Icicle锡尖.
Illuminance照度.
Image Transfer影像转移.
Immersion Plating浸镀.
Impedance阻抗.
Impedance Match阻抗匹配.
Impregnate含浸.
In-Circuit Testing组装板电测.
Inclusion异物,夹杂物.
Indexing Hole基准孔.
Inductance(L)电感.
Infrared(IR)红外线.
Input/Output输入/输出.
Insert, Insertion插接.
Inspection Overlay套检底片.
Insulation Resistance绝缘电阻.
Integrated Circuit(IC)绩体电路器.
Inter Face接口.
Interconnection互连.
Intermetallic Compound (IMC)接口共化物.
Internal Stress内应力.
Interposer互边导电物.
Interstitial Via-Hole(IVH)局部层间导通孔.
Invar殷钢(63.8%Fe,36%Ni,0.2%C).
Ion Cleanliness离子清洁度.
Ion Exchange Resins离子交换树脂.
Ion Migration离子迁移.
Ionizable (Ionic) Contaimination离子性污染.
Ionization游离,电离.
Ionization Voltage (Corona Level)电离化电压(电缆内部狭缝空气中,引起其
电离所施加之最小电压).
IPC美国印刷电路板协会.
Isolation隔离性,隔绝性.
                         *****J*****
JEDEC(Joint Electronic Device  联合电子组件工程委员会.
Engineering Council)
J-LeadJ型接脚.
Job Shop专业工厂.
Joule焦耳.
Jumper Wire跳线.
Junction接(合)面,接头.
Just-In-Time(JIT)适时供应,及时出现.
                        *****K*****
Kapton聚亚醯胺软板.
Karat克拉    (1克拉(钻石)=0.2g   纯金则24k金为
100%的钝金.
Kauri-Butanol Value考立丁醇值(简称K.B.值).
Kerf.切形,裁剪.
Kevlar聚醯胺纤维.
Key电键
Key Board键盘.
Kiss Pressure吻压, 低压.
Knoop Hardness努普硬度.
Known Good Die(KGD)已知之良好芯片.
Kovar科伐合金(Fe53%,Ni29%,Co17%).
Kraft Paper牛皮纸.
                        *****L*****
Lamda Wave延伸平波.
Laminar Flow平流.
Laminar Structure片状结构.
Laminate Void板材空洞.
Laminate(s)基板.
Lamination Void压合空洞.
Laminator压膜机.
Land孔环焊垫,表面焊垫.
Landless Hole无环通孔.
Laser Direct Imaging (LDI)雷射直接成像.
Laser Maching雷射加工法.
Laser Photogenerator(LPG), Laser Photoplotter雷射曝光机.
Laser Soldering雷射焊接法.
Lay Back 刃角磨损.