Connector连接器.
Contact Angle接触角.
Contact Area接触区.
Contact Resistance接触电阻.
Continuity连通性.
Contract Service协力厂,分包厂.
Controlled Depth Drilling定深钻孔.
Conversion Coating 转化皮膜.
Coplanarity共面性.
Copolymer共聚物.
Copper Foil铜皮.
Copper Mirror Test铜镜试验.
Copper Paste铜膏.
Copper-Invar-Copper (CIC)综合夹心板.
Core Material内层板材,核材.
Corner Crack 通孔断角.
Corner Mark板角标记.
Counterboring方型扩孔.
Countersinking锥型扩孔.
Coupling Agent 偶合剂.
Coupon, Test Coupon板边试样.
Coverlay/Covercoat表护层.
Crack裂痕.
Crazing白斑.
Crease皱折.
Creep潜变.
Crossection Area截面积.
Crosshatch Testing十字割痕试验.
Crosshatching十字交叉区.
Crosslinking, Crosslinkage交联,架桥.
Crossover越交,搭交.
Crosstalk噪声, 串讯.
Crystalline Melting Point晶体熔点.
C-Stage C阶段.
Cure硬化,熟化.
Current Density电流密度.
Current-Carrying Capability载流能力.
Curtain Coating濂涂法.
                        *****D*****
Daisy Chained Design菊瓣设计.
Datum Reference基准参考.
Daughter Board子板.
Debris碎屑,残材.
Deburring去毛头.
Declination Angle斜射角.
Definition边缘逼真度.
Degradation 劣化.
Degrasing脱脂.
Deionized Water去离子水.
Delamination分离.
Dendritic Growth 枝状生长.
Denier丹尼尔(是编织纺织所用各种纱类直径单位,
定义9000米纱束所具有的重量(以克米计)).
Densitomer透光度计.
Dent凹陷.
Deposition 皮膜处理.
Desiccator干燥器.
Desmearing去胶渣.
Desoldering解焊.
Developer显像液,显像机.
Developing显像 .
Deviation偏差.
Device电子组件.
Dewetting缩锡.
D-glassD玻璃.
Diaze Film偶氮棕片.
Dichromate重铬 酸盐.
Dicing芯片分割.
Dicyandiamide(Dicy)双氰胺.
Die 冲模.
Die Attach晶粒安装.
Die Bonding晶粒接着.
Die Stamping冲压.
Dielectric 介质.
Dielectric Breakdown Voltage介质崩溃电压.
Dielectric Constant介质常数.
Dielectric Strength介质强度.
Differential Scanning Calorimetry(DSC)微差扫瞄热卡分析法.
Diffusion Layer扩散层.
Digitizing数字化.
Dihedral Angle双反斜角.
Dimensional Stability尺度安定性.
Diode二极管.
Dip Coating浸涂法.
Dip Soldering浸焊法.
DIP(Dual Inline Package)双排脚封装体.
Dipole偶极,双极.
Direct / Indirect Stencil直接/间接版膜.
Direct Emulsion直接乳胶.
Direct Plating直接电镀.
Discrete Compenent散装零件.
Discrete Wiring Board散线电路板,复线板.
Dish Down碟型下陷.
Dispersant分散剂.
Dissipation Factor散失因素.
Disspation Factor散逸因子.
Disturbed Joint受扰焊点.
Doctor Blade修平刀,刮平刀.
Dog Ear狗耳.
Doping掺杂.
Double Layer双电层.
Double Treated Foil双面处理铜箔.
Drag In / Drag Out带[进/带出.
Drag Soldering拖焊.
Drawbridging吊桥效应.
Drift漂移.
Drill Facet钻尖切削面.
Drill Pointer钻针重磨机.
Drilled Blank已钻孔的裸板.
Dross浮渣.
Drum Side铜箔光面.
Dry Film干膜.
Dual Wave Soldering 双波焊接.
Ductility展性.
Dummy Land假焊垫.
Dummy, Dummying假镀(片).
Durometer橡胶硬度计.
DYCOstrate电浆蚀孔增层法.
Dynamic Flex(FPC)动态软板.
                        *****E*****
E-Beam (Electron Beam)电子束.
Eddy Current涡电流.
Edge Spacing板边空地.
Edge-Board Connector板边(金手指)承接器.
Edge-Board Contact板边金手指.
Edge-Dip Solderability Test板边焊锡性测试.
EDTA乙二胺四乙酸.
Effluent排放物.
E-glass电子级玻璃.
Elastomer弹性体.
Electric Strength(耐)电性强度.
Electrodeposition电镀.
Electro-deposition Photoresist电着光阻, 电泳光阻.
Electroforming电铸.
Electroless-Deposition无电镀.
Electrolytic Tough Pitch电解铜..
Electrolytic-Cleaning电解清洗.
Electro-migration电迁移.
Electro-phoresis电泳动, 电渗.
Electro-tinning镀锡.
Electro-Winning电解冶炼.
Elongation 延伸性, 延伸率.
Embossing凸出性压花.
EMF(Electromotive Force)电动势.
EMI(Electromagnetic Interference)电磁干扰.
Emulsion乳化.
Emulsion Side药膜面.
Encapsulating胶囊.
Encroachment沾污,侵犯.
End Tap封头.
Entek有机护铜处理.
Entrapment夹杂物.
Entry Material盖板.
Epoxy Resin环氧树脂.
Etch Factor蚀刻因子.
Etchant蚀刻剂(液).
Etchback回蚀.
Etching Indicator蚀刻指针.
Etching Resist蚀刻阻剂.
Eutetic Composition共融组成.
Exotherm放热(曲线).
Exposure曝光.
Eyelet铆眼.
                        *****F*****
Fabric纲布.
Face Bonding反面朝下结合.
Failure故障.
Fan Out Wiring/Fan In Wiring扇出布线/扇入布线.
Farad 法拉.
Farady法拉第.
Fatigue Strength抗疲劳强度.
Fault缺陷.
Fault Plane断层面.
Feed Through Hole导通孔.
Feeder 进料器.
Fiber Exposure玻纤显露.
Fiducial Mark基准记号.
Filament纤丝.
Fill纬向.
Filler填充料.
Fillet内圆填角.
Film底片.
Film Adhesive接着膜,粘合膜.
Filter过滤器.
Fine Line细线.
Fine Pitch密脚距,密线距,密垫距.
Fineness粒度, 纯度.
Finger手指.
Finishing终修(饰).
Finite Element Method有限要素分析法.
First Article首产品.
First Pass-Yield初检良品率.
Fixture夹具.
Flair刃角变形.
Flame Point自燃点.
Flame Resistant耐燃性.
Flammability Rate燃性等级.
Flare扇形崩口.
Flash Plating闪镀.
Flashover闪络.
Flat Cable扁平排线.
Flat Pack扁平封装(之零件).
Flatness平坦度.
Flexible Printed Circuit (FPC)软板.
Flexural Failure挠曲损坏.
Flexural Module弯曲模数, 抗挠性模数 .
Flexural Strength抗挠强度.
Flip Chip覆晶,扣晶.
Flocculation絮凝.
Flood Stroke Print覆墨冲程印刷.
Flow Soldering (Wave Soldering)流焊.