电路板术语总整理
       *****A*****
Abietic Acid松脂酸.
Abrasion Resistance耐磨性.
Abrasives磨料,刷材.
ABS树脂.
Absorption吸收(入).
Ac Impedance交流阻抗.
Accelerated Test(Aging)加速老化(试验).
Acceleration速化反应.
Accelerator 加速剂,速化剂.
Acceptability,Acceptance 允收性,允收.
Access Hole露出孔,穿露孔.
Accuracy准确度.
Acid Number (Acid Value)酸值.
Acoustic Microscope (AM)感音成像显微镜.
Acrylic压克力(聚丙烯酸树脂).
Actinic Light (or Intensity, or Radiation)有效光.
Activation活化.
Activator活化剂.
Active Carbon活性炭.
Active Parts(Devices)主动零件.
Acutance解像锐利度.
Addition Agent添加剂.
Additive Process加成法.
Adhesion附着力.
Adhesion Promotor附着力促进剂.
Adhesive胶类或接着剂.
Admittance导纳(阻抗的倒数).
Aerosol喷雾剂,气熔胶,气悬体.
Aging老化.
Air Inclusion气泡夹杂.
Air Knife风刀.
Algorithm算法.
Aliphatic Solvent脂肪族溶剂.
Aluminium Nitride(AlN)氮化铝.
Ambient Tamp环境温度.
Amorphous无定形,非晶形.
Amp-Hour安培小时.
Analog Circuit/Analog Signal模拟电路/模拟讯号.
Anchoring Spurs着力爪.
Angle of  Contack接触角.
Angle of Attack攻角.
Anion阴离子.
Anisotropic异向性,单向的.
Anneal 韧化(退火).
Annular Ring孔环.
Anode阳极.
Anode Sludge阳极泥.
Anodizing阳极化.
ANSI美国标准协会.
Anti-Foaming Agent消泡剂.
Anti-pit Agent抗凹剂.
AOI自动光学检验.
Apertures开口,钢版开口.
AQL品质允收水准.
AQL(Acceptable Quality Level)允收品质水准.
Aramid Fiber聚醯胺纤维.
Arc Resistance耐电弧性.
Array排列.
Artwork底片.
ASIC特定用途绩体电路器.
Aspect Ratio纵横比.
Assembly组装装配.
A-stage A阶段.
ATE自动电测设备.
Attenuation讯号衰减.
Autoclave压力锅.
Axial-lead轴心引脚.
Azeotrope共沸混合液.
                       *****B*****
Back Light (Back Lighting)背光法.
Back Taper反锥斜角.
Backpanels, Backplanes支撑板.
Back-up 垫板.
Balanced Transmission Lines平衡式传输线.
Ball Grid Array球脚数组(封装).
Bandability弯曲性.
Banking Agent护岸剂.
Bare Chip Assembly裸体芯片组装.
Barrel孔壁,滚镀.
Base Material基材.
Basic Grid基本方格.
Batch批.
Baume波美度(凡液体比重比水重则  Be=145-(145÷Sp.Gr)
凡液体比重比水轻则  Be=140÷(Sp.Gr-130)
*Sp.Gr 为比重即同体绩物质对"纯水"1g/cm的比值).
Beam lead光芒式的平行密集引脚.
Bed-of-Nail Testing针床测试.
Bellows Conact弹片式接触.
Beta Ray Backscatter贝他射线反弹散射.
Bevelling切斜边.
Bias斜张纲布,斜纤法.
Bi-Level Stencil]双阶式钢板.
Binder粘结剂.
Bits头(Drill Bits).
Black Oxide黑氧化层.
Blanking冲空断开.
Bleack 漂洗.
Bleeding溢流.
Blind Via Hole肓通孔.
Blister局部性分层或起泡.
Block Diagram电路系统块图 .
Blockout封纲.
Blotting干印.
Blotting Paper吸水纸.
Blow Hole吹孔.
Blue Plaque蓝纹(锡面钝化层).
Blur Edge (Circle)模糊边带(圈).
Bomb Sight弹标.
Bond Strength结合强度.
Bondability结合性.
Bonding Layer结合层接着层.
Bonding Sheet(Layer)接合片.
Bonding Wire结合线.
Bow, Bowing板弯.
Braid编线.
Brazing硬焊(用含银的铜锌合金焊条).
在425℃~870℃下进行熔接的方式).
Break Point显像点.
Break-away Panel可断开板.
Breakdown Voltage崩溃电压.
Break-out破出.
Bridging搭桥.
Bright Dip光泽浸渍处理.
Brightener光泽剂.
Brown Oxide棕氧化.
Brush Plating刷镀.
B-stageB阶段.
Build Up Process增层法制程.
Build-up堆积.
Bulge鼓起.
Bump 突块.
Bumping Process凸块制程.
Buoyancy浮力.
Buried Via Hole埋导孔.
Burn-in高温加速老化试验.
Burning烧焦.
Burr毛头.
Bus Bar汇电杆.
Butter Coat 外表树脂层.
                        *****C*****
C4 Chip JointC4芯片焊接.
Cable电缆.
CAD计算机辅助设计.
Calendered Fabric轧平式纲布.
Cap Lamination帽式压合法.
Capacitance电容.
Capacitive Coupling电容耦合.
Capillary Action毛细作用.
Carbide碳化物.
Carbon Arc Lamp碳弧灯.
Carbon Treatment, Active活化炭处理.
Card卡板.
Card Cages/Card Racks电路板构装箱.
Carlson Pin卡氏定位稍.
Carrier载体.
Cartridge滤心.
Castallation堡型绩体电路器.
Catalyzed Board, Catalyzed Substrate催化板材.
Catalyzing催化.
Cathode阴极.
Cation阴向离子, 阳离子.
Caul Plate隔板.
Cavitation空泡化  半真空.
Center-to-Center Spacing中心间距.
Ceramics陶瓷.
Cermet陶金粉.
Certificate证明书.
CFC氟氢碳化物.
Chamfer倒角.
Characteristic Impedance特性阻抗.
Chase纲框.
Check List检查清单.
Chelate螯合.
Chemical Milling化学研磨.
Chemical Resistance抗化性.
Chemisorption化学吸附.
Chip芯片(粒).
Chip Interconnection芯片互连.
Chip on Board芯片粘着板.
Chip On Glass晶玻接装(COG).
Chisel钻针的尖部.
Chlorinated Solvent含氯溶剂,氯化溶剂.
Circumferential Separation环状断孔.
Clad/Cladding披覆.
Clean Room无尘室.
Cleanliness清洁度.
Clearance余地,余环.
Clinched Lead Terminal紧箝式引脚.
Clinched-wire Through Connection通孔弯线连接法 .
Clip Terminal绕线端接.
Coat, Coating皮膜表层.
Coaxial Cable同轴缆线.
Coefficient of Thermal Expansion热膨胀系数.
Co-Firing共绕.
Cold Flow冷流.
Cold Solder Joint冷焊点.
Collimated Light平行光.
Colloid胶体.
Columnar Structure柱状组织.
Comb Pattern梳型电路.
Complex Ion错离子.
Component Hole零件孔.
Component Orientation零件方向.
Component Side组件面.
Composites,(CEM-1,CEM-3)复合板材.
Condensation Soldering凝热焊接,液化放热焊接.
Conditioning整孔.
Conductance导电.
Conductive Salt导电盐.
Conductivity导电度.
Conductor Spacing导体间距.
Conformal Coating贴护层.
Conformity吻合性, 服贴性.