印刷电路板表面组件自动化检验
| 更新日期： 2007-9-14 10:45:09 |
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8. Sauvola, J. and Pietikainen, M., “Adaptive document image binarization,” Pattern Recognition, 33,236-255(2000).
9. Zhou, H., Kassim, A. A., and Ranganath, S., “A fast algorithm for detecting die extrusion defects in IC packages ,” Machine Vision and Applications, 11,37-41(1998).
10. Zhou, H., Kassim, A. A., and Ranganath, S.,“Automatic IC orientation checks ,” Machine Vision and Applications, 12, 107-112(2000).
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